案例分析: 现代精密测控的关键 (docx)

File size: 525 kB Language: 中文(简体)

受惠人工智能、5G和物联网等新技术的迅速发展,半导体的需求近年不断扩大,设备商也纷纷加大投入开发新机型以应对精密先进制程的严苛挑战。半导体制造核心装备包括光刻机双工件台、晶圆级键合设备、激光退火先进设备和EFEM等。设计精密,无论对核心零件的规格或是测控稳定性都有极严谨的要求。这个领域多年被欧美日厂商垄断,鲜有中国国内厂商有能力涉足其中。

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