新闻稿: 雷尼绍在2015年formnext展览会上推出新的增材制造产品 (docx)
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Language: 中文(简体)
全球工程技术公司雷尼绍于2015年11月17日至20日在2015年法兰克福国际精密成型及3D打印展览会 (formnext 2015) 上展出了新产品。以Renishaw plc名义参展的展台位于3.1号馆E60号,同时在D78号展台以Renishaw LBC Engineering的名义参展。雷尼绍展出的新产品包括两款新的金属增材制造 (AM) 系统,以及全新的成型准备软件包。
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