White light and Raman images of a silicon wafer indented with a diamond tip at high temperature and pressure (jpg)

The microscope white light image shows the location and appearance of the indentation. The Raman map reveals changes in structure, composition, and stress. At the indentation site, crystalline silicon IV has been transformed to amorphous silicon (green), and small spots of silicon carbide (red) have formed. Compressive (light yellow) and tensile (dark yellow) stresses are also revealed, as is the absence of stress along the cracks (black). Data courtesy of G K Banini, University of Cambridge, UK.