雷尼绍光栅全力提升表面贴装组件印刷技术水平 (docx)
File size: 99 kB
Language: 中文（简体）
电子产品，尤其是智能手机、平板电脑等3C产品，预计未来将会持续朝高性能、轻薄微型化的方向发展。台湾友厚新科技股份有限公司一直致力于为业界开发针对工业制程的高阶设备，这与雷尼绍追求创新的理念一致。他们开发的被动组件印刷设备采用雷尼绍ATOM™ 系列超微型光栅系统，为电子产品实现微型化。
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